JCCOM TOP
Development of "Enhanced FI-X" connector (board side)
for interface with upgraded retention at mating
FI-X with upgraded retention at mating

::Outline::

The market for monitors is rapidly expanding in the large LCD market.
The market growth showed a year-on-year increase of one and a half that of last year's and is expected to continue to expand this year.
The existing FI-X Series connector was endorsed by SPWG* as an LCD interface for notebooks and is being used for various models in the market at present.
JAE has now developed the "Enhanced FI-X" (board side)" connector, adding a robust structure and enhanced mating retention to the existing FI-X Series, which is used in the fast-growing market for desktop monitors.
* SPWG: The Standard Panels Working Group, one of the standards for LC panels.

::Features::

(1) Folded connection shell and increased insulator thickness have enhanced tolerance against mating stresses compared to that of the existing FI-X for board side.
(2) Ensured required minimum height of 2.3mm when mounted for top-mount type; height of 1.6mm from the board for bottom type.
(3) Lock structure between connectors available.
(4) Complete mating to existing FI-X on harness side.
(5) Lead-free product

::Applicable market::

Devices in which LVDS transmission is used for internal wiring such as LCD monitors and televisions

::General specifications::

Contacts : 30
Rated current : 1A/1 terminal for both AC, DC
Rated voltage : 200V/1 terminal for both AC, DC
Contact resistance : 40milliohms or less
Insulation resistance : 100Megaohms or more
Operating temperature range : -40Cel to +80Cel
Lifetime: : 20 times
Withstand voltage : AC500Vr.m.s/1 minute

::Materials/Finishing::

Components Materials/finishing
Contact
Copper alloy/ Connecting area(mating area): Au plating over Ni
Terminal area(soldering for board): Sn-Cn plating over Ni
Insulator Thermoplastic resiniUL94V-0j
Shell Stainless/Sn plating


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